U.S. Patent 8006889 was awarded to Boston Scientific Scimed, Inc. on 2011-08-30 and describes a “Method and device for full thickness resectioning of an organ.” This patent has been cited 314 times by other U.S. patents which places it in the top 500 cited patents since 2010 according to our law firm research, and makes it of the most innovative medical technology patents in the field of instruments. The abstract states:

A full-thickness resection system comprises a flexible endoscope and a stapling mechanism, wherein the endoscope is slidably received through at least a portion of the stapling mechanism. The stapling mechanism comprises an anvil and a stapling head mounted to the anvil so that the anvil and the stapling head are moveable with respect to one another between a tissue receiving position and a stapling position and wherein a gap formed between the stapling head and the anvil is larger in the tissue receiving position than it is in the stapling position. A position adjusting mechanism is provided for moving the anvil and the stapling head between the tissue receiving and stapling positions and a staple firing mechanism sequentially fires a plurality of staples from the stapling head across the gap against the anvil and through any tissue received in the gap and a knife cuts a portion of tissue received within the gap. A control unit which remains outside the body is coupled to the stapling mechanism for controlling operation of the position adjusting mechanism and the staple firing mechanism. Link: U.S. Patent 8006889

This patent was originally filed on 2011-01-19 which gives it a processing time of 223 days, compared to an average processing time of 837 in the field. Boston Scientific Scimed, Inc. has 3730 total patents. The first named inventor is Gerhard Buess of Tubingen, Baden-Wurttemberg. The primary examiner was Scott A. Smith.

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